Die Sorting, Recon
KEY FEATURE
- Auto alignment
- Maximum 8” wafer (non-expansion) supported
- Range of chip size supported : 100um~5000um
- Chroma unique methodology on Pick&Place
- Auto loading/unloading
- Real time data output, real time management
- Remote control
- Auto recipe management
- Support output on FRAME, GELPAK, WAFFLE PAK
- Support customized pattern of die placement