Die Sorting, Recon


  • Auto alignment
  • Maximum 8” wafer (non-expansion) supported
  • Range of chip size supported : 100um~5000um
  • Chroma unique methodology on Pick&Place
  • Auto loading/unloading
  • Real time data output, real time management
  • Remote control
  • Auto recipe management
  • Support output on FRAME, GELPAK, WAFFLE PAK
  • Support customized pattern of die placement



68,Hwa-Ya 1st Rd.,

Hwa-Ya Technology Park,

Taoyuan Hsien 333, Taiwan

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